SL2S3003 datasheet(82/82 Pages) NXP

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NXP Semiconductors

SL2S3003/SL2S3003TT

ICODE 3 (TagTamper)

Contents

General description .........................................1

1.1

Contactless energy and data transfer ................2

1.2

Anticollision ........................................................2

1.3

Data protection .................................................. 2

Features and benefits ..................................... 3

2.1

ICODE 3 RF interface (ISO/IEC 15693) ............ 3

2.2

EEPROM ........................................................... 3

2.3

Data protection .................................................. 3

Applications ..................................................... 4

Ordering information .......................................5

Block diagram ..................................................6

Wafer layout ..................................................... 8

6.1

Pin description ................................................... 8

Mechanical specification ................................ 9

7.1

Wafer specification ............................................ 9

7.1.1

Fail die identification ........................................10

7.1.2

Map file distribution ......................................... 10

Functional description .................................. 11

8.1

Block description ............................................. 11

8.2

Memory organization ....................................... 12

8.2.1

Unique identifier ...............................................13

8.2.2

Originality signature .........................................14

8.2.2.1

Originality signature at delivery ....................... 14

8.2.3

Configuration memory ..................................... 15

8.2.3.1

Counter feature ................................................28

8.2.3.2

TagTamper feature (SL2S3003TT) .................. 30

8.2.3.3

NFC ASCII mirror feature ................................ 31

8.2.4

Configuration of delivered ICs ......................... 32

8.3

Communication principle ................................. 32

8.4

State diagram .................................................. 33

8.5

Supported commands ......................................34

8.5.1

Mandatory commands ..................................... 34

8.5.1.1

INVENTORY .................................................... 34

8.5.1.2

STAY QUIET ....................................................34

8.5.2

Optional commands .........................................34

8.5.2.1

READ SINGLE BLOCK ................................... 34

8.5.2.2

WRITE SINGLE BLOCK ..................................34

8.5.2.3

LOCK BLOCK ..................................................35

8.5.2.4

READ MULTIPLE BLOCKS .............................35

8.5.2.5

SELECT ...........................................................35

8.5.2.6

RESET TO READY ......................................... 35

8.5.2.7

WRITE AFI ...................................................... 35

8.5.2.8

LOCK AFI ........................................................ 36

8.5.2.9

WRITE DSFID ................................................. 36

8.5.2.10 LOCK DSFID ................................................... 36

8.5.2.11 GET SYSTEM INFORMATION ........................36

8.5.2.12 GET MULTIPLE BLOCK SECURITY

STATUS ........................................................... 36

8.5.2.13 FAST READ MULTIPLE BLOCK ..................... 37

8.5.3

Custom commands ..........................................38

8.5.3.1

GET RANDOM NUMBER ................................38

8.5.3.2

SET PASSWORD ............................................ 39

8.5.3.3

WRITE PASSWORD ....................................... 40

8.5.3.4

LOCK PASSWORD ......................................... 41

8.5.3.5

64-BIT PASSWORD PROTECTION ................42

8.5.3.6

PROTECT PAGE .............................................43

8.5.3.7

LOCK PAGE PROTECTION CONDITION .......45

8.5.3.8

DESTROY ........................................................46

8.5.3.9

ENABLE PRIVACY .......................................... 47

8.5.3.10 INVENTORY READ .........................................48

8.5.3.11 FAST INVENTORY READ ...............................53

8.5.3.12 SET EAS ......................................................... 53

8.5.3.13 RESET EAS .................................................... 54

8.5.3.14 LOCK EAS .......................................................55

8.5.3.15 EAS ALARM .................................................... 56

8.5.3.16 PASSWORD PROTECT EAS/AFI ................... 57

8.5.3.17 WRITE EAS ID ................................................58

8.5.3.18 GET NXP SYSTEM INFORMATION ............... 59

8.5.3.19 STAY QUIET PERSISTENT ............................ 61

8.5.3.20 READ SIGNATURE ......................................... 62

8.5.3.21 READ CONFIG ................................................63

8.5.3.22 WRITE CONFIG .............................................. 64

8.5.3.23 READ TT ......................................................... 65

8.5.3.24 PICK RANDOM ID .......................................... 66

8.5.3.25 24-bit counter ...................................................67

8.6

Error handling .................................................. 69

8.6.1

Transmission errors ......................................... 69

8.6.2

Commands not supported or options ...............69

8.6.2.1

Non-addressed Mode ...................................... 69

8.6.2.2

Addressed or Selected Mode .......................... 69

8.6.3

Parameter out of range ................................... 69

8.6.3.1

Read commands ............................................. 69

8.6.3.2

Write and lock commands ............................... 69

8.7

Data integrity ................................................... 70

8.8

RF interface ..................................................... 70

Limiting values ...............................................71

Characteristics ...............................................72

10.1

Wafer memory characteristics ......................... 72

10.2

Interface characteristics ...................................72

Bare die outline ............................................. 73

Abbreviations .................................................74

References ......................................................75

Revision history .............................................76

Legal information ...........................................77

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: https://www.nxp.com

Date of release: 28 March 2024

Document identifier: SL2S3003/SL2S3003TT

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