2. Major point of SMT reflow

(a) Solder pad layout : please refer to 5.1

(b) Steel plate and foot distance printing

Foot distance printing (mm/mils)

Steel Plate thickness (mm)

> 0.65mm/25 mil

0.18mm

0.65mm/25 mils~0.5mm/20mils

0.15mm

0.50mm/20 mils~0.40mm/16mils

0.12mm

<=0.40 mm/16 mils

0.10mm

The IR reflow and temperature of Soldering for Pb Free

☆

IR reflow Pb Free Process suggestion profile

(1) Soldering recommend paste is

Sn 96.5/Ag 3.5

(2) Ramp-up rate (217℃ to Peak) + 3℃/second max

(3) Temp. maintain at 175 +/-25℃ 180 seconds max

(4) Temp. maintain above 217 ℃ 60-150 seconds

(5) Peak temperature range

245℃ +20℃/ -10 ℃ time within 5 ℃ of actually peak temperature (tp) 10~20

seconds

(6) Ramp down rate +6 ℃/second max.

SMD Transient Voltage Suppressors

Recommendation for Soldering

※

Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of

the manufacturing process, and the specification of the reflow furnace.

Peak Temp. 260℃ 3sec

.

Peak Temp. 245℃ 10sec

.

Pre-Heat 140℃~200℃

60~120 Sec.