PCAL6408ABSHP datasheet(4/59 Pages) NXP

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NXP Semiconductors

PCAL6408A

Low-voltage translating, 8-bit I2C-bus/SMBus I/O expander with interrupt output, reset, and

configuration registers

3 Ordering information

Package

Type number

Topside

marking Name

Description

Version

PCAL6408ABS L8A

HVQFN16

plastic thermal enhanced very thin quad flat package; no leads;

16 terminals; body 3 × 3 × 0.85 mm

SOT758-1

PCAL6408APW PL6408A TSSOP16

plastic thin shrink small outline package; 16 leads; body width

4.4 mm

SOT403-1

PCAL6408AHK L8

XQFN16

plastic, extremely thin quad flat package; no leads; 16 terminals;

body 1.80 × 2.60 × 0.50 mm

SOT1161-1

PCAL6408AEX L8

XFBGA16[1] plastic, extremely thin fine-pitch ball grid array package; 16 balls;

body 1.6 × 1.6 × 0.5 mm

SOT1354-1

PCAL6408AEX1 18X[2]

X2QFN16

plastic, thermal enhanced super thin quad flat package; no leads;

16 terminals; 1.6 mm x 1.6 mm x 0.35 mm body

SOT1896-1

Table 1. Ordering information

[1]

XFBGA16 package is discontinued with lifetime buy November 2016; new designs must use X2QFN16 package.

[2]

"X" rotates from 1 to 5 and indicates the work week of the indicated month

3.1 Ordering options

Type number

Orderable part

number

Package

Packing method

Minimum

order quantity

Temperature

PCAL6408ABS

PCAL6408ABSHP

HVQFN16

Reel 13" Q2/T3

*standard mark SMD

6000

Tamb = -40 °C to +85 °C

PCAL6408APW

PCAL6408APWJ

TSSOP16

Reel 13" Q1/T1

*standard mark SMD

2500

Tamb = -40 °C to +85 °C

PCAL6408AHK

PCAL6408AHKX

XQFN16

Reel 7" Q1/T1

*standard mark SMD

4000

Tamb = -40 °C to +85 °C

PCAL6408AEX

PCAL6408AEXX

XFBGA16[1] Reel 7" Q1/T1

*standard mark SMD

5000

Tamb = -40 °C to +85 °C

PCAL6408AEX1

PCAL6408AEX1Z

X2QFN16

Reel 7" Q2/T1

*standard mark SMD

5000

Tamb = -40 °C to +85 °C

Table 2. Ordering options

[1]

XFBGA16 package is discontinued with lifetime buy November 2016; new designs must use X2QFN16 package.

PCAL6408A

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.3 — 14 October 2024

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