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STM32G473MB Datasheet(PDF) 196 Page - STMicroelectronics |
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STM32G473MB Datasheet(HTML) 196 Page - STMicroelectronics |
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196 / 229 page  Package information STM32G473xB STM32G473xC STM32G473xE 196/229 DS12712 Rev 5 6.2 WLCSP81 package information (B068) This WLCSP is a 81-ball, 4.02 x 4.27 mm, 0.4 mm pitch wafer level chip scale package. Figure 55. WLCSP81 - Outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 106. WLCSP81 - Mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A(2) - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025 - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 4.00 4.02 4.04 0.157 0.158 0.159 B068_WLCSP81_DIE469_ME_V1 1 9 e1 e2 e J A F G D E A A2 A1 bbb Z A3 A2 A1 BALL LOCATION DETAIL A b ccc ddd M Z Z X Y M b(81x) SEATING PLANE z BUMP DETAIL A ROTATED 90 eee Z TOP VIEW BOTTOM VIEW FRONT VIEW SIDE VIEW A1 eee (4X) |
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