ST72324BJ2 datasheet(171/188 Pages) STMICROELECTRONICS

Part #	ST72324BJ2

Description	8-bit MCU, 3.8 to 5.5 V operating range with 8 to 32 Kbyte Flash/ROM, 10-bit ADC, 4 timers, SPI, SCI

PDF	188 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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171 / 188 page

ST72324B

Package characteristics

171/188

13.5

Thermal characteristics

13.6

Soldering information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

Table 117.

Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to ambient):

LQFP44 10x10

LQFP32 7x7

DIP42 600mil

SDIP32 200mil

°C/W

Power dissipation(1)

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation

of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip

internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the

application.

500

TJmax

Maximum junction temperature(2)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

ST72324BJ2 Datasheet(PDF) 171 Page - STMicroelectronics