HS-139RH, HS-139EH

FN3573 Rev 6.01

Page 2 of 4

May 5, 2025

Ordering Information

ORDERING SMD NUMBER

(Note 1)

PART NUMBER

(Note 2)

PACKAGE

DESCRIPTION

(RoHS Compliant)

PKG.

DWG. #

CARRIER TYPE

TEMP. RANGE (°C)

5962F9861303VCC

HS1-139EH-Q

14 Ld SBDIP

D14.3

Tube

-55 to +125

5962F9861301VCC

HS1-139RH-Q

14 Ld SBDIP

D14.3

Tube

-55 to +125

5962F9861301QCC

HS1-139RH-8

14 Ld SBDIP

D14.3

Tube

-55 to +125

HS1-139RH/PROTO

(Note 3)

HS1-139RH/PROTO

14 Ld SBDIP

D14.3

Tube

-55 to +125

5962F9861301VXC

HS9-139RH-Q

14 Ld FLATPACK

K14.A

Tray

-55 to +125

5962F9861301QXC

HS9-139RH-8

14 Ld FLATPACK

K14.A

Tray

-55 to +125

5962F9861303VXC

HS9-139EH-Q

14 Ld FLATPACK

K14.A

Tray

-55 to +125

HS9-139RH/PROTO



(Note 3)

HS9-139RH/PROTO

14 Ld FLATPACK

K14.A

Tray

-55 to +125

5962F9861303V9A



(Note 4)

HS0-139EH-Q

Die

N/A

N/A

-55 to +125

5962F9861301V9A



(Note 4)

HS0-139RH-Q

Die

N/A

N/A

-55 to +125

HS0-139RH/SAMPLE

(Notes 3, 4)

HS0-139RH/SAMPLE

Die

N/A

N/A

-55 to +125

NOTES:

1. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the

table must be used when ordering.

2. These Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb

and Pb-free soldering operations.

3. The /PROTO and /SAMPLE are not rated or certified for Total Ionizing Dose (TID) or Single Event Effect (SEE) immunity. These parts are intended for

engineering evaluation purposes only. The /PROTO parts meet the electrical limits and conditions across temperature specified in the DLA SMD and are

in the same form and fit as the qualified device. The /SAMPLE parts are capable of meeting the electrical limits and conditions specified in the DLA SMD.

The /SAMPLE parts do not receive 100% screening across temperature to the DLA SMD electrical limits. These part types do not come with a Certificate

of Conformance because they are not DLA qualified devices.

4. Die product tested at TA = + 25°C. The wafer probe test includes functional and parametric testing sufficient to make the die capable of meeting the

electrical performance outlined in SMD.