■ Specifications and Test Methods

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Post-treatment

Non treatment:Let sit for 24+/-2hours at room temperature, then measure.

Destructive Physical

Analysis

Appearance

No defects or abnormalities.

Per EIA-469

Moisture Resistance

Appearance

No defects or abnormalities.

Mounting method

Solder the capacitor on the test substrate

Capacitance Change

Within +/-12.5%

Test Time

Apply the 24h treatment shown below, 10 consecutive times.

Q or D.F.

DF≦0.02

Temperature and Humidity cycle

I.R.(Room Temp.)

Within the specified initial value.

Post-treatment

Non treatment:Let sit for 24+/-2hours at room temperature, then measure.

Temperature Cycling

Appearance

No defects or abnormalities.

Mounting method

Reflow solder the capacitor on the test substrate

Capacitance Change

Within +/-7.5%

Pre-treatment

Heat treatment:Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours

Q or D.F.

Within the specified initial value.

at room temperature, then measure.

I.R.(Room Temp.)

Within the specified initial value.

Cycles

1000cycles

Temperature Cycling

High Temperature

Exposure (Storage)

Appearance

No defects or abnormalities.

Mounting method

Solder the capacitor on the test substrate

Capacitance Change

Within +/-10%

Test Temperature

150+/-3℃

Q or D.F.

DF≦0.02

Test Time

1000+/-12h

I.R.(Room Temp.)

Within the specified initial value.

Post-treatment

Non treatment:Let sit for 24+/-2hours at room temperature, then measure.

No

Item

Specification

Test Method（Compliant Standard:AEC-Q200）

Pre-and Post-Stress

Electrical Test

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GC331CD7LP683KX19-00B

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