2. Land Dimensions

2-1. Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Flow soldering can only be used for products with a chip size of 2.0x1.25mm to 3.2x1.6mm.

(in mm)

Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.

Table 2 Reflow Soldering Method

(in mm)

< Applicable to beyond Rated Voltage of 200VDC >

2-2. Dimensions of Slit (Example)

Preparing the slit helps flux cleaning and resin coating on the back of the capacitor.

However, the length of the slit design should be as short as possible

to prevent mechanical damage in the capacitor.

A longer slit design might receive more severe mechanical stress from the PCB.

Recommended slit design is shown in the Table.

4.5×3.2

1.0 to 2.8

4.8 to 5.3

5.7×5.0

1.0 to 4.0

6.6 to 7.1

3.2×1.6

1.0 to 2.0

3.2 to 3.7

3.2×2.5

1.0 to 2.0

4.1 to 4.6

3.5 to 4.8

L×W

d

e

2.0×1.25

-

-

GC□

55

5.7×5.0

4.0 to 4.6

1.4 to 1.6

1.8 to 2.3

GC□

43

4.5×3.2

3.0 to 3.5

1.2 to 1.4

2.3 to 3.0

GC□

32

3.2×2.5

2.0 to 2.4

1.0 to 1.2

0.8 to 1.1

GC□

31

3.2×1.6

2.2 to 2.4

0.8 to 0.9

1.0 to 1.4

GC□

21

2.0×1.25

1.0 to 1.2

0.6 to 0.7

1.0 to 1.4

Series

Chip Dimension

(L/W) Code

Chip(L×W)

a

b

c

GC□

31

3.2×1.6

2.2 to 2.6

1.0 to 1.1

c

GC□

21

2.0×1.25

1.0 to 1.2

0.9 to 1.0

0.8 to 1.1

Series

Chip Dimension

(L/W) Code

Chip(L×W)

a

b

GC331CD7LP683KX19-00B

27