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LMP91200

SNAS571E – JANUARY 2012 – REVISED FEBRUARY 2016

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Product Folder Links: LMP91200

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Copyright © 2012–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For soldering specifications see product folder at www.ti.com and SNOA549.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/RθJA. All numbers apply for packages soldered directly onto a PCB.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Supply Voltage (VS = VDD – GND)

–0.3

6

V

Voltage between any two pins

–0.3

VDD + 0.3

V

Current out at any pin

5

mA

Junction Temperature(4)

150

°C

Storage Temperature, Tstg

–65

150

°C

(1)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge(1)

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(2)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(3)

±1000

Machine Model

±150

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage (VS = VDD – GND)

1.8

5.5

V

Temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LMP91200

UNIT

PW (TSSOP)

16 PINS

RθJA

Junction-to-ambient thermal resistance

31

°C/W