Data Sheet

ADRF5420

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 14

For the recommended operating conditions, see Table 1.

Table 3. Absolute Maximum Ratings

Parameter

Rating

Positive Supply Voltage

−0.3V to +3.6V

Negative Supply Voltage

−3.6V to +0.3V

Digital Control Input1

Voltage

−0.3V to VDD + 0.3V

Current

3mA

RF Input Power, Dual Supply2 (VDD = +3.3V, VSS

= −3.3V, f = 3GHz to 70GHz, TCASE = 85°C3)

Through Path

25dBm

Hot Switching

22dBm

RF Input Power, Single Supply (VDD = 3.3V, VSS =

0V, f = 3GHz to 70GHz, TCASE = 85°C3)

Through Path

15dBm

Hot Switching (RFC)

12dBm

RF Input Power Under Unbiased Condition (VDD

and VSS = 0V)

15dBm

Temperature

Junction, TJ

135°C

Storage Range

−65°C to +150°C

Reflow

260°C

1 Overvoltages at the digital control input are clamped by internal diodes.

Current must be limited to the maximum rating given.

2 For power derating over frequency, see Figure 2 and Figure 3.

3 For 105°C operation, the power handling degrades from the TCASE = 85°C

specification by 3 dB for dual supply and 1dB for single supply.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Only one absolute maximum rating can be applied at any one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to package bottom)

thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC1

Unit

CD-30-3, Through Path

537

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to the thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C

Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for the ADRF5420

Table 5. ADRF5420, 30-Ball BUMPED_CHIP

ESD Model

Withstand Threshold (V)

HBM

±500 for the RF pins

±2000 for the supply and digital control pins

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged

devices and circuit boards can discharge without detection.

Although this product features patented or proprietary protec-

tion circuitry, damage may occur on devices subjected to high

energy ESD. Therefore, proper ESD precautions should be

taken to avoid performance degradation or loss of functionality.