ICL3232IVZ datasheet(33/36 Pages) RENESAS

33 / 36 page

ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243

7. Package Outline Drawings

FN4805 Rev.23.00

Page 33 of 36

Apr.26.19

M28.173

28 Lead Thin Shrink Small Outline Package (TSSOP)

Rev 1, 5/10

DETAIL "X"

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

SIDE VIEW

END VIEW

Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

Dimensions are measured at datum plane H.

Dimensioning and tolerancing per ASME Y14.5M-1994.

Dimension does not include dambar protrusion. Allowable protrusion

shall be 0.08mm total in excess of dimension at maximum material

condition. Minimum space between protrusion and adjacent lead

is 0.07mm.

Dimension in ( ) are for reference only.

Conforms to JEDEC MO-153.

NOTES:

SEATING PLANE

PLANE

GAUGE

0.05 MIN

0.15 MAX

0°-8°

0.60 ±0.15

0.90

1.00 REF

0.25

SEE DETAIL "X"

0.25

(0.65 TYP)

(5.65)

(0.35 TYP)

(1.45)

6.40

4.40 ± 0.10

0.65

1.20 MAX

PIN #1

I.D. MARK

9.70± 0.10

-0.06

0.15 +0.05

-0.10

+0.15

-0.06

+0.05

0.20 C B A

0.10 C

- 0.05

0.10

C B A

For the most recent package outline drawing, see M28.173.

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