ICL3232IVZ datasheet(28/36 Pages) RENESAS

28 / 36 page

ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243

7. Package Outline Drawings

FN4805 Rev.23.00

Page 28 of 36

Apr.26.19

Notes:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “B” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.13mm (0.005 inch) total in excess of “B”

dimension at maximum material condition.

10. Controlling dimension: MILLIMETER. Converted inch dimensions are

not necessarily exact.

INDEX

AREA

-B-

0.25(0.010)

C A

-A-

-C-

SEATING PLANE

0.10(0.004)

0.25(0.010)

0.25

0.010

GAUGE

PLANE

M16.209 (JEDEC MO-150-AC ISSUE B)

16 Lead Shrink Small Outline Plastic Package (SSOP)

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.078

2.00

0.002

0.05

0.065

0.072

1.65

1.85

0.009

0.014

0.22

0.38

0.004

0.009

0.09

0.25

0.233

0.255

5.90

6.50

0.197

0.220

5.00

5.60

0.026 BSC

0.65 BSC

0.292

0.322

7.40

8.20

0.022

0.037

0.55

0.95

N16

0°

8°

0°

8°

Rev. 3 6/05

For the most recent package outline drawing, see M16.209.

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