Package information

EMIF06-AUD01F2

12/14

Figure 33.

Flip chip tape and reel specification

Note:

More packing information is available in the application notes:

AN1235: “Flip chip: Package description and recommendations for use”

AN1751: "EMI Filters: Recommendations and measurements"

Figure 31.

Marking

Figure 32.

Footprint recommendation

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year ww = week)

E

Copper pad Diameter:

250µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

2.10

4 ± 0.1

4.0 ± 0.1

2.0 ± 0.05

Ø 1.55 ± 0.05

0.73 ± 0.05

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm