B72580E1140S262 datasheet(72/81 Pages) EPCOS

72 / 81 page

CTVS - Ceramic transient voltage suppressors

SMD multilayer varistors (MLVs), automotive E series

PPD ML PD

2021-01-08

Please read Cautions and warnings and

Page 72 of 81

Important notes at the end of this document.

Note:

Leaching of the termination

Effective area at the termination might be lost if the soldering temperature and/or immersion time are

not kept within the recommended conditions. Leaching of the outer electrode should not exceed 25%

of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B, shown below as

mounted on substrate.

As a single chip

As mounted on substrate

Notes for proper soldering

5.1

Preheating and cooling

According to IEC 60068-2-58. Please refer to section 2 of this chapter.

5.2

Repair/ rework

Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for rework

purposes.

5.3

Cleaning

All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning

solution according to the type of flux used. The temperature difference between the components and

cleaning liquid must not be greater than +100 °C. Ultrasonic cleaning should be carried out with the

utmost caution. Too high ultrasonic power can impair the adhesive strength of the metallized

surfaces.

5.4

Solder paste printing (reflow soldering)

An excessive application of solder paste results in too high a solder fillet, thus making the chip more

susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive strength on

the outer electrodes and thus weakens the bonding to the PCB. The solder should be applied

smoothly to the end surface.

B72580E1140S262 Datasheet(PDF) 72 Page - EPCOS