B72580E1140S262 datasheet(78/81 Pages) EPCOS

78 / 81 page

CTVS - Ceramic transient voltage suppressors

SMD multilayer varistors (MLVs), automotive E series

PPD ML PD

2021-01-08

Please read Cautions and warnings and

Page 78 of 81

Important notes at the end of this document.

Storage



Only store CTVS in their original packaging. Do not open the package prior to processing.



Storage conditions in original packaging: temperature −25 to +45°C, relative humidity ≤75%

annual average, maximum 95%, dew precipitation is inadmissible.



Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the

packaging material may be deformed or CTVS may stick together, causing problems during

mounting.



Avoid contamination of the CTVS surface during storage, handling and processing.



Avoid storing CTVS devices in harmful environments where they are exposed to corrosive gases

for example (SOx, Cl).



Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.



Solder CTVS components after shipment from TDK Electronics within the time specified:

−

CTVS with Ni barrier termination, 12 months

−

CTVS with AgPt termination, 6 months

−

SHCV 24 months

Handling



Do not drop CTVS components and allow them to be chipped.



Do not touch CTVS with your bare hands - gloves are recommended.



Avoid contamination of the CTVS surface during handling.



Washing processes may damage the product due to the possible static or cyclic mechanical loads

(e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which

might lead to reduced reliability or lifetime.

Mounting



When CTVS devices are encapsulated with sealing material or overmolded with plastic material,

electrical characteristics might be degraded and the lifetime reduced.



Make sure an electrode is not scratched before, during or after the mounting process.



Make sure contacts and housings used for assembly with CTVS components are clean before

mounting.



The surface temperature of an operating CTVS can be higher. Ensure that adjacent components

are placed at a sufficient distance from a CTVS to allow proper cooling.



Avoid contamination of the CTVS surface during processing.

Soldering



Complete removal of flux is recommended to avoid surface contamination that can result in an

instable and/or high leakage current.



Use resin-type or non-activated flux.



Bear in mind that insufficient preheating may cause ceramic cracks.



Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.

B72580E1140S262 Datasheet(PDF) 78 Page - EPCOS

B72580E1140S262 Datasheet(HTML) 78 Page - EPCOS

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81

Datasheet Download

Link URL