B72580E1140S262 datasheet(73/81 Pages) EPCOS

73 / 81 page

CTVS - Ceramic transient voltage suppressors

SMD multilayer varistors (MLVs), automotive E series

PPD ML PD

2021-01-08

Please read Cautions and warnings and

Page 73 of 81

Important notes at the end of this document.

5.5

Selection of flux

Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue after

soldering could lead to corrosion of the termination and/or increased leakage current on the surface of

the component. Strong acidic flux must not be used. The amount of flux applied should be carefully

controlled, since an excess may generate flux gas, which in turn is detrimental to solderability.

5.6

Storage of CTVSs

Solderability is guaranteed for one year from date of delivery for multilayer varistors, CeraDiodes and

ESD/EMI filters (half a year for chips with AgPt terminations) and two years for SHCV components,

provided that components are stored in their original packages.

Storage temperature:

-25 °C to +45 °C

Relative humidity:

≤

75% annual average, ≤95% on 30 days a year

The solderability of the external electrodes may deteriorate if SMDs and leaded components are

stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous

acid gas or hydrogen sulfide).

Do not store SMDs and leaded components where they are exposed to heat or direct sunlight.

Otherwise the packing material may be deformed or SMDs/ leaded components may stick together,

causing problems during mounting.

After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the

SMDs or leaded components as soon as possible.

Solder CTVS components after shipment from TDK Electronics within the time specified:

CTVS with Ni barrier termination:

12 months

CTVS with AgPt termination:

6 months

SHCV (leaded components):

24 months

5.7

Placement of components on circuit board

Especially in the case of dual-wave soldering, it is of advantage to place the components on the board

before soldering in that way that their two terminals do not enter the solder bath at different times.

Ideally, both terminals should be wetted simultaneously.

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