Package information

STA8058

12/14

4

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 5.

LFBGA104 (11x7x1.4mm) mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.400

0.0551

A1

0.210

0.0083

A2

0.990

0.0390

A3

0.200

0.0079

A4

0.800

0.0315

b

0.350

0.400

0.450 0.0138 0.0157 0.0177

D

10.900 11.000 11.100 0.4291 0.4331 0.4370

D1

9.600

0.3780

E

6.900

7.000

7.100 0.2717 0.2756 0.2795

E1

5.600

0.2205

e

0.800

0.0315

F

0.700

0.0276

ddd

0.100

0.0039

eee

0.150

0.0059

fff

0.080

0.0031

LFBGA104

Low profile Fine Pitch Ball Grid Array

Body: 11 x 7 x 1.4mm

8054244 B