H8SLASH3028F datasheet(692/923 Pages) RENESAS

692 / 923 page

Rev. 2.00, 09/03, page 662 of 890

Item

Symbol

Min

Typ

Max

Unit

Test Conditions

Input leakage

current

STBY, RES,

NMI, FWE

MD2 to MD0

|Iin|—

—

1.0

µA

Vin = 0.5 V to

VCC – 0.5 V

Port 7

—

1.0

µA

Vin = 0.5 V to

AVCC – 0.5 V

Three-state

leakage

current

Ports 1 to 6

Ports 8 to B

|ITSI|—

—

1.0

µA

Vin = 0.5 V to

VCC – 0.5 V

Input pull-up

MOS current

Ports 2, 4,

and 5

–Ip

—

300

µA

Vin = 0 V

FWE

Cin

—

NMI

—

Input

capacitance

All input pins

except NMI,

and FWE

—

Vin = 0 V

f = fmin

Ta = 25°C

Current

dissipation*

Normal

operation

ICC*

—37

(3.3 V)

f = 25 MHz

Sleep mode

—

(3.3 V)

Module

standby mode

—21

(3.3 V)

Standby mode

—

1.0

µA

≤ 50°C

—

µA

50°C

< Ta

Flash memory

programming/

erasing*

—47

68mA

f = 25 MHz

During A/D

conversion

AICC

—0.6

1.5

During A/D

and D/A

conversion

—0.6

1.5

Analog

power supply

current

Idle

—

0.01

5.0

µA

DASTE = 0

Reference

current

During A/D

conversion

AICC

—

0.45

0.8

During A/D

and D/A

conversion

—2.0

3.0

Idle

—

0.01

5.0

µA

DASTE = 0

RAM standby voltage

VRAM

2.0

—

Notes: 1. If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open.

Connect AVCC and VREF to VCC, and connect AVSS to VSS.

H8/3028F Datasheet(PDF) 692 Page - Renesas Technology Corp

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