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MCP6V06-E/MD Datasheet(PDF) 19 Page - Microchip Technology

Part # MCP6V06-E/MD
Description  300 關A, Auto-Zeroed Op Amps
PDF  44 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP6V06-E/MD Datasheet(HTML) 19 Page - Microchip Technology

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© 2008 Microchip Technology Inc.
DS22093B-page 19
MCP6V06/7/8
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs
The non-inverting and inverting inputs (VIN+, VIN–, …)
are high-impedance CMOS inputs with low bias
currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 1.8V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Chip Select (CS) Digital Input
This pin (CS) is a CMOS, Schmitt-triggered input that
places the MCP6V08 op amps into a low power mode
of operation.
3.5
Exposed Thermal Pad (EP)
There is an internal connection between the Exposed
Thermal Pad (EP) and the VSS pin; they must be con-
nected to the same potential on the Printed Circuit
Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (θJA).
MCP6V06
MCP6V07
MCP6V08
Symbol
Description
TDFN
SOIC
DFN
SOIC
TDFN
SOIC
661
16
6
VOUT, VOUTA
Output (op amp A)
222
22
2
VIN–, VINA–
Inverting Input (op amp A)
333
33
3
VIN+, VINA+
Non-inverting Input
(op amp A)
444
44
4
VSS
Negative Power Supply
——
5
5
——
VINB+
Non-inverting Input
(op amp B)
——
6
6
——
VINB–
Inverting Input (op amp B)
——
7
7
——
VOUTB
Output (op amp B)
778
87
7
VDD
Positive Power Supply
——
——
—
8
CS
Chip Select (op amp A)
1, 5, 8
1, 5, 8
—
—
1, 5, 8
1, 5
NC
No Internal Connection
9
—
9
—
9
—
EP
Exposed Thermal Pad (EP);
must be connected to VSS



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