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ST7568 Datasheet(PDF) 2 Page - Sitronix Technology Co., Ltd. |
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ST7568 Datasheet(HTML) 2 Page - Sitronix Technology Co., Ltd. |
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2 / 73 page ![]() ST7568 Ver 2.2 2/73 2008/01/04 3. ST7568 Pad Arrangement (COG) Chip Size: 10,220 um × 1000 um Bump Pitch: PAD NO 1 ~ 148 , 250 ~ 272 : 75.5 um (com/seg) PAD NO 149 ~ 248 : 75 um (I/O) PAD NO 148 ~ 149 : 114 um PAD NO 248 ~ 249 : 93.5 um PAD NO 249 ~ 250 : 95.9 um Bump Size: PAD NO 1 ~ 125 , 137 ~ 248 , 250 ~ 261 : 55(x) um × 60(y) um PAD NO 249 : 92(x) um × 60(y) um PAD NO 126 ~ 136 , 262 ~ 272 : 60(x)um × 55(y) um Bump Height: 17 um Chip Thickness: 635 um Y X (0,0) 1 261 137 125 272 262 136 126 A2024 Mark 55 60 55 60 Bump Size of Top & Bottom Bump Size of Right & Left 250 249 248 RES 92 60 Bump Size of RES unit: um 75 60 30 15 15 (4766,410) unit:um 30 6 6 6 6 75 60 30 15 15 (-4766,410) unit: um 30 75 60 10 30 15 15 30 (4763,-410) unit:um 75 60 10 30 15 15 30 (-4763,-410) unit:um Metal area Bump area |
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