PIC12F609-ESLASHP datasheet(153/212 Pages) MICROCHIP

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 2010 Microchip Technology Inc.

DS41302D-page 153

PIC12F609/615/617/12HV609/615

D101*

COSC2

Capacitive Loading Specs on

Output Pins

OSC2 pin

—

In XT, HS and LP modes when

external clock is used to drive

OSC1

D101A* CIO

All I/O pins

—

Program Flash Memory

D130

Cell Endurance

10K

100K

—

E/W

-40°C

 TA +85°C

D130A

Cell Endurance

10K

—

E/W

+85°C

 TA +125°C

D131

VPR

VDD for Read

VMIN

—5.5

VMIN = Minimum operating

voltage

D132

VPEW

VDD for Bulk Erase/Write

4.5

—

5.5

D132A

VPEW

VDD for Row Erase/Write(6)

VMIN

—5.5

D133

TPEW

Erase/Write cycle time

—

2.5

D134

TRETD

Characteristic Retention

—

Year

Provided no other specifications

are violated

16.8

DC Characteristics:

PIC12F609/615/617/12HV609/615-I (Industrial)

PIC12F609/615/617/12HV609/615-E (Extended) (Continued)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

 TA  +85°C for industrial

-40°C

 TA  +125°C for extended

Param

No.

Sym

Characteristic

Min

Typ†

Max

Units

Conditions

These parameters are characterized but not tested.

†

Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are

not tested.

Note

In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external

clock in RC mode.

Negative current is defined as current sourced by the pin.

The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent

normal operating conditions. Higher leakage current may be measured at different input voltages.

This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled.

This specification applies to all weak pull-up pins, including the weak pull-up found on GP3/MCLR. When GP3/MCLR is

configured as MCLR reset pin, the weak pull-up is always enabled.

Applies to PIC12F617 only.

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