PIC12F609-ESLASHP datasheet(157/212 Pages) MICROCHIP

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 2010 Microchip Technology Inc.

DS41302D-page 157

PIC12F609/615/617/12HV609/615

TABLE 16-2:

OSCILLATOR PARAMETERS

Standard Operating Conditions (unless otherwise stated)

Operating Temperature

-40°C

TA +125°C

Param

No.

Sym

Characteristic

Freq.

Tolerance

Min

Typ†

Max

Units

Conditions

OS06

TWARM

Internal Oscillator Switch

when running(3)

——

—

TOSC

Slowest clock

OS07

INTOSC

Internal Calibrated

INTOSC Frequency(2)

(4MHz)

1%

3.96

4.0

4.04

MHz

VDD = 3.5V, TA = 25°C

2%

3.92

4.0

4.08

MHz

2.5V

VDD  5.5V,

0°C

 TA  +85°C

5%

3.80

4.0

4.2

MHz

2.0V

VDD  5.5V,

-40°C

 TA  +85°C (Ind.),

-40°C

 TA  +125°C (Ext.)

OS08

INTOSC

Internal Calibrated

INTOSC Frequency(2)

(8MHz)

1%

7.92

8.0

8.08

MHz

VDD = 3.5V, TA = 25°C

2%

7.84

8.0

8.16

MHz

2.5V

VDD  5.5V,

0°C

 TA  +85°C

5%

7.60

8.0

8.40

MHz

2.0V

VDD  5.5V,

-40°C

 TA  +85°C (Ind.),

-40°C

 TA  +125°C (Ext.)

OS10*

TIOSC ST

INTOSC Oscillator Wake-

up from Sleep

Start-up Time

—

5.5

sVDD = 2.0V, -40°C to +85°C

—3.5

sVDD = 3.0V, -40°C to +85°C

—3

sVDD = 5.0V, -40°C to +85°C

These parameters are characterized but not tested.

†

Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are

not tested.

Note

Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on

characterization data for that particular oscillator type under standard operating conditions with the device executing

code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected

current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin.

When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.

To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as

possible. 0.1

F and 0.01 F values in parallel are recommended.

By design.

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