PIC12F609-ESLASHP datasheet(154/212 Pages) MICROCHIP

154 / 212 page

PIC12F609/615/617/12HV609/615

DS41302D-page 154

 2010 Microchip Technology Inc.

16.9

Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

 TA  +125°C

Param

No.

Sym

Characteristic

Typ

Units

Conditions

TH01

JA

Thermal Resistance

Junction to Ambient

84.6*

C/W

8-pin PDIP package

149.5*

C/W

8-pin SOIC package

211*

C/W

8-pin MSOP package

60*

C/W

8-pin DFN 3x3mm package

44*

C/W

8-pin DFN 4x4mm package

TH02

JC

Thermal Resistance

Junction to Case

41.2*

C/W

8-pin PDIP package

39.9*

C/W

8-pin SOIC package

39*

C/W

8-pin MSOP package

C/W

8-pin DFN 3x3mm package

3.0*

C/W

8-pin DFN 4x4mm package

TH03

TDIE

Die Temperature

150*

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL

Internal Power Dissipation

—

PINTERNAL = IDD x VDD

(NOTE 1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD -

VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TDIE - TA)/

JA

(NOTE 2)

These parameters are characterized but not tested.

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient temperature.

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