SS6730 datasheet(10/12 Pages) SSC

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SS6730

POWER DISSIPATION

The maximum dissipation of the SS6730

depends on the thermal resistance of the case

and circuit board, the temperature difference

between the die junction and ambient air, and

the rate of air flow. The rate of temperature rise

greatly

affected

the

mounting

pad

configuration on the PCB, the board material,

and the ambient temperature. When the IC

mounting with good thermal conductivity is used,

the junction will be low even if the power

dissipation is great.

The power dissipation across the device is

P = IOUT (VIN-VOUT).

The maximum power dissipation is:

)

(R?

)

MAX

−

where

TJ-TA is the temperature difference

between the die junction and the surrounding air,

JB is the thermal resistance

of the package,

and R

BA is the thermal resistance through the

PCB, copper traces, and other materials to the

surrounding air.

As a general rule, the lower the temperature,

the better the reliability of the device, so the

PCB mounting pad should provide maximum

thermal conductivity to maintain low device

temperature.

The GND pin performs the dual function of

providing an electrical connection to ground and

channeling heat away. Therefore, connecting the

GND pin to ground with a large pad or ground

plane would increase the power dissipation and

reduce the device temperature.

100

150

0.01

0.1

100

STABLE REGION

COUT=1µF

IOUT (mA)

Fig. 20 Max Power Dissipation, COUT=1µF

100

150

0.01

0.1

100

Stable Region

COUT=2.2µF

IOUT (mA)

Fig. 21 Max Power Dissipation, COUT=2.2µF

100

150

0.01

0.1

100

Stable Region

COUT=3.3µF

IOUT (mA)

Fig. 22 Max Power Dissipation, COUT=3.3µF

100

150

0.01

0.1

100

Stable Region

COUT=10µF

IOUT (mA)

Fig. 23 Max Power Dissipation, COUT=10µF

1/26/2004 Rev.2.02

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