SPC560B64L5 datasheet(69/134 Pages) STMICROELECTRONICS

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SPC560B54/6x

Electrical characteristics

Doc ID 15131 Rev 6

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4.6.5

I/O pad current specification

The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is

associated to a VDD/VSS supply pair as described in Table 22.

Table 23 provides I/O consumption figures.

In order to ensure device reliability, the average current of the I/O on a single segment

should remain below the IAVGSEG maximum value.

Table 22.

I/O supply segments

Package

Supply segment

LBGA208

(1)

Equivalent to LQFP176 segment pad distribution

MCKO

MDOn

/MSEO

LQFP176

pin7 –

pin27

pin28 –

pin57

pin59 –

pin85

pin86 –

pin123

pin124 –

pin150

pin151 –

pin6

—

LQFP144

pin20 –

pin49

pin51 –

pin99

pin100 –

pin122

pin 123 –

pin19

—

LQFP100

pin16 –

pin35

pin37 –

pin69

pin70 –

pin83

pin84 –

pin15

—

LBGA208 available only as development package for Nexus2+

Table 23.

I/O consumption

Symbol

Parameter

Conditions(1)

Value

Unit

Min Typ Max

ISWTSLW

(2)

CC D

Dynamic I/O current for

SLOW configuration

CL = 25 pF

VDD = 5.0 V ± 10%,

PAD3V5V = 0

——

VDD = 3.3 V ± 10%,

PAD3V5V = 1

——

ISWTMED

(2)

CC D

Dynamic I/O current for

MEDIUM configuration

CL = 25 pF

VDD = 5.0 V ± 10%,

PAD3V5V = 0

——

VDD = 3.3 V ± 10%,

PAD3V5V = 1

——

ISWTFST

(2)

CC D

Dynamic I/O current for

FAST configuration

CL = 25 pF

VDD = 5.0 V ± 10%,

PAD3V5V = 0

—

110

VDD = 3.3 V ± 10%,

PAD3V5V = 1

——

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