WM9093ECSSLASHR datasheet(82/84 Pages) WOLFSON

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WM9093

Production Data

PD, March 2012, Rev 4.2

PACKAGE DIMENSIONS

B: 20 BALL W-CSP PACKAGE 2.500 X 2.000 X 0.7mm BODY, 0.50 mm BALL PITCH

CORNER

TOP VIEW

0.10

2 X

DETAIL 2

0.10

2 X

bbb

SOLDER BALL

DETAIL 1

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.

3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.

0.219

2.000 BSC

2.000

0.250

1.500 BSC

0.500 BSC

2.500

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.700

0.391

0.416

0.441

0.754

0.646

0.244

0.269

0.040

0.036

0.044

0.314 BSC

BOTTOM VIEW

0.270

DETAIL 1

DM086.A

2.560

2.100

WM9093ECS/R Datasheet(PDF) 82 Page - Wolfson Microelectronics plc

WM9093ECS/R Datasheet(HTML) 82 Page - Wolfson Microelectronics plc

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