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SFP830D Datasheet(PDF) 2 Page - SemiWell Semiconductor |
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SFP830D Datasheet(HTML) 2 Page - SemiWell Semiconductor |
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2 / 5 page ![]() SFP830D Thermal Characteristics Symbol Parameter Ratings Unit RθJC Thermal Resistance Junction to Case 1.65 ℃/W RθCS Thermal Resistance Case to Sink Typ. 0.5 ℃/W RθJA Thermal Resistance Junction to Ambient 62.5 ℃/W Electrical Characteristics ( TC = 25℃ Unless otherwise noted) Symbol Items Conditions Ratings Unit Min Typ. Max BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250uA 500 V ΔBVDSS /ΔTJ Breakdown Voltage Temperature coefficient ID =250uA, Reference to 25℃ 0.6 V/℃ IDSS Zero gate voltage Drain Current VDS = 500V, VGS = 0V VDS = 400V, TS = 125℃ 1 10 uA IGSSF Gate body leakage current Forward VGS = 30V, VDS = 0V 100 nA IGSSR Gate body leakage current Reverse VGS = -30V, VDS = 0V -100 nA On Characteristics VGS(th) Gate Threshold Voltage VGS = VDS, ID = 250uA 2.0 4.0 V RDS(ON) Static Drain-Source On-Resistance VGS = 10V, ID = 2.5A 1.1 1.5 Dynamic Characteristics Ciss Input Capacitance VDS = 25 V, VGS = 0V f = 1.0MHz 525 pF Coss output Capacitance 75 pF Crss Reverse Transfer Capacitance 15 pF 2/5 |
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