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ISL70001ASEHFE Datasheet(PDF) 19 Page - Intersil Corporation |
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ISL70001ASEHFE Datasheet(HTML) 19 Page - Intersil Corporation |
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19 / 25 page ![]() ISL70001ASEH 19 FN8365.0 May 22, 2013 3. Place an array of thermal vias below the thermal land. - Via array size: ~8x8=64 thermal vias - Via diameter: ~0.3mm drill diameter with plated copper on the inside of each via. - Via pitch: ~1.2mm. - Vias should drop to and contact as much buried metal area as feasible to provide the best thermal relief. Heat Sink Electrical Potential The heat sink is electrically isolated and unbiased. The heatsink may be electrically connected to any potential which offers the best thermal relief through conductive mounting materials (conductive epoxy, solder, etc) or may be left unbiased through the use of electrically non-conductive mounting materials (non-conductive epoxy, Sil-pad, kapton film, etc.). |
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