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MCR03EZPFX1002 Datasheet(PDF) 35 Page - International Rectifier |
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MCR03EZPFX1002 Datasheet(HTML) 35 Page - International Rectifier |
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35 / 36 page ![]() 35 IR3837MPbF Rev 1.31 Stencil Design Stencils for PQFN can be used with thicknesses of 0.100-0.250mm (0.004-0.010"). Stencils thinner than 0.100mm are unsuitable because they deposit insufficient solder paste to make good solder joints with the ground pad; high reductions sometimes create similar problems. Stencils in the range of 0.125mm-0.200mm (0.005-0.008"), with suitable reductions, give the best results. Evaluations have shown that the best overall performance is achieved using the stencil design shown in following figure. This design is for a stencil thickness of 0.127mm (0.005"). The reduction should be adjusted for stencils of other thicknesses. Stencil pad sizing (all dimensions in mm) Stencil pad spacing (all dimensions in mm) |
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