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DSPIC30F2011AT-30E/PF Datasheet(PDF) 214 Page - Microchip Technology

Part # DSPIC30F2011AT-30E/PF
Description  High-Performance, 16-Bit Digital Signal Controllers
PDF  228 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F2011AT-30E/PF Datasheet(HTML) 214 Page - Microchip Technology

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dsPIC30F6011/6012/6013/6014
DS70117F-page 212
© 2006 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A2
α
A1
A
c
(F)
L
φ
β
D
E
#leads = n1
E1
p
B
D1
n
1
2
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
.630 BSC
NOM
INCHES
.630 BSC
.551 BSC
.551 BSC
Overall Width
Overall Length
Foot Angle
Foot Length
Pins per Side
Overall Height
Number of Pins
Lead Width
Drawing No. C04-066
Lead Thickness
Molded Package Thickness
* Controlling Parameter
JEDEC Equivalent: MS-026
Mold Draft Angle Bottom
Mold Draft Angle Top
Molded Package Width
Molded Package Length
Footprint
Notes:
Pitch
Standoff
11
β
Dimension Limits
α
B
D1
E1
c
φ
D
E
(F)
L
11
.012
.004
.018
0
MIN
A
A1
A2
n1
p
Units
n
.037
.002
12
11
12
13
12
.015
3.5
.039 REF
.024
.018
.008
13
.030
7
16
.031 BSC
.039
64
.041
.006
.047
MAX
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.30
0.09
11
0.45
0
0.37
12
1.00 REF
0.60
3.5
MILLIMETERS*
0.95
0.05
MIN
0.80 BSC
1.00
16
NOM
64
13
0.45
0.20
13
0.75
7
1.05
0.15
1.20
MAX
Revised 7-20-06
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M



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