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APW7008 Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
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APW7008 Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
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2 / 22 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.4 - Jun., 2009 APW7008 www.anpec.com.tw 2 Ordering and Marking Information Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD- 020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Symbol Parameter Rating Unit VOUT VOUT to GND -0.3 to +6 V VIN VIN to GND -0.3 to +6 V VC1+, VC1-, VC2+, VC2- C1+, C1-, C2+, C2- to GND -0.3 to +6 V VILED1-4 ILED1-4 to GND -0.3 to +6 V VCTRL0/1/2, VEN CTRL0/1/2, EN to GND -0.3 to +6 V VISET ISET to GND -0.3 to 2 V TJ Maximum Junction Temperature +150 °C TSTG Storage Temperature -65 ~ 150 °C TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 °C Absolute Maximum Ratings (Note 1, 2) Note 1: Stresses beyond the absolute maximum rating may damage the device and operating in the absolute maximum rating conditions for extended periods may affect device reliability. Note 2: The maximum allowable power dissipation at any T A (ambient temperature) is calculated using: PD(max) = (TJ – TA) / θJA ; T J=125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature. Thermal Characteristics Symbol Parameter Typical Value Unit R θJA Thermal Resistance − Junction to Ambient QFN3x3-16 40 °C/W APW7008 Handling Code Temperature Range Package Code Package Code QA : QFN3x3-16 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device Assembly Material APW7008 QA : APW 7008 XXXXX XXXXX - Date Code |
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