CD00237391 datasheet(167/177 Pages) STMICROELECTRONICS

167 / 177 page

STM32F20xxx

Revision history

Doc ID 15818 Rev 9

167/177

13-Jul-2010

(continued)

Added USB OTG_FS features in Section 2.2.28: Universal serial bus

on-the-go full-speed (OTG_FS).

Updated VCAP_1 and VCAP_2 capacitor value to 2.2 µF in Figure 17:

Power supply scheme.

Removed DAC, modified ADC limitations, and updated I/O

compensation for 1.8 to 2.1 V range in Table 13: Limitations depending

on the operating power supply range.

Added VBORL, VBORM, VBORH and IRUSH in Table 17: Embedded reset

and power control block characteristics.

Removed table Typical current consumption in Sleep mode with Flash

memory in Deep power down mode. Merged typical and maximum

current consumption sections and added Table 18: Typical and

maximum current consumption in Run mode, code with data

processing running from Flash memory (ART accelerator disabled),

Table 19: Typical and maximum current consumption in Run mode,

code with data processing running from Flash memory (ART

accelerator enabled) or RAM, Table 20: Typical and maximum current

consumption in Sleep mode, Table 21: Typical and maximum current

consumptions in Stop mode, Table 22: Typical and maximum current

consumptions in Standby mode, and Table 23: Typical and maximum

current consumptions in VBAT mode.

Update Table 32: Main PLL characteristics and added Section 5.3.11:

PLL spread spectrum clock generation (SSCG) characteristics.

Added Note 8 for CIO in Table 44: I/O static characteristics.

Updated Section 5.3.18: TIM timer characteristics.

Added TNRST_OUT in Table 47: NRST pin characteristics.

Updated Table 50: I2C characteristics.

Removed 8-bit data in and data out waveforms from Figure 45: ULPI

timing diagram.

Removed note related to ADC calibration in Table 65. Section 5.3.20:

12-bit ADC characteristics: ADC characteristics tables merged into one

single table; tables ADC conversion time and ADC accuracy removed.

Updated Table 66: DAC characteristics.

Updated Section 5.3.22: Temperature sensor characteristics and

Section 5.3.23: VBAT monitoring characteristics.

Update Section 5.3.26: Camera interface (DCMI) timing specifications.

Added Section 5.3.27: SD/SDIO MMC card host interface (SDIO)

characteristics, and Section 5.3.28: RTC characteristics.

Added Section 6.2: Thermal characteristics. Updated Table 89:

LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm package

mechanical data and Figure 81: LQFP176 - Low profile quad flat

package 24 × 24 × 1.4 mm, package outline.

Changed tape and reel code to TX in Table 92: Ordering information

scheme.

Added Table 93: Main applications versus package for STM32F2xxx

microcontrollers. Updated figures in Appendix A.3: USB OTG full

speed (FS) interface solutions and A.4: USB OTG high speed (HS)

interface solutions. Updated Figure 92: Audio player solution using

PLL, PLLI2S, USB and 1 crystal and Figure 93: Audio PLL (PLLI2S)

providing accurate I2S clock.

Table 94.

Document revision history (continued)

Date

Revision

Changes

CD00237391 Datasheet(PDF) 167 Page - STMicroelectronics

CD00237391 Datasheet(HTML) 167 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL