CD00237391 datasheet(170/177 Pages) STMICROELECTRONICS

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Revision history

STM32F20xxx

170/177

Doc ID 15818 Rev 9

22-Apr-2011

(continued)

Updated Typical and maximum current consumption conditions, as

well as Table 18: Typical and maximum current consumption in Run

mode, code with data processing running from Flash memory (ART

accelerator disabled) and Table 19: Typical and maximum current

consumption in Run mode, code with data processing running from

Flash memory (ART accelerator enabled) or RAM. Added Figure 21,

Figure 22, Figure 23, and Figure 24.

Updated Table 20: Typical and maximum current consumption in Sleep

mode, and added Figure 25 and Figure 26.

Updated Table 21: Typical and maximum current consumptions in Stop

mode. Added Figure 27: Typical current consumption vs temperature

in Stop mode.

Updated Table 22: Typical and maximum current consumptions in

Standby mode and Table 23: Typical and maximum current

consumptions in VBAT mode.

Updated On-chip peripheral current consumption conditions and

Table 24: Peripheral current consumption.

Updated tWUSTDBY and tWUSTOP, and added Note 3 in Table 25: Low-

power mode wakeup timings.

Maximum fHSE_ext and minimum tw(HSE) values updated in Table 26:

High-speed external user clock characteristics.

Updated C and gm in Table 28: HSE 4-26 MHz oscillator

characteristics. Updated RF, I2, gm, and tsu(LSE) in Table 29: LSE

oscillator characteristics (fLSE = 32.768 kHz).

Added Note 1 and updated ACCHSI, IDD(HSI, and tsu(HSI) in Table 30:

HSI oscillator characteristics. Added Figure 32: ACCHSI versus

temperature.

Updated fLSI, tsu(LSI) and IDD(LSI) in Table 31: LSI oscillator

characteristics. Added Figure 33: ACCLSI versus temperature

Table 32: Main PLL characteristics: removed note 1, updated tLOCK,

jitter, IDD(PLL) and IDDA(PLL), added Note 2 for fPLL_IN minimum and

maximum values.

Table 33: PLLI2S (audio PLL) characteristics: removed note 1, updated

tLOCK, jitter, IDD(PLLI2S) and IDDA(PLLI2S), added Note 2 for fPLLI2S_IN

minimum and maximum values.

Added Note 1 in Table 34: SSCG parameters constraint.

Updated Table 35: Flash memory characteristics. Modified Table 36:

Flash memory programming and added Note 2 for tprog. Updated tprog

and added Note 1 in Table 37: Flash memory programming with VPP.

Modified Figure 37: Recommended NRST pin protection.

Updated Table 40: EMI characteristics and EMI monitoring conditions

in Section : Electromagnetic Interference (EMI). Added Note 2 related

to VESD(HBM)in Table 41: ESD absolute maximum ratings.

Updated Table 44: I/O static characteristics.

Added Section 5.3.15: I/O current injection characteristics.

Modified maximum frequency values and conditions in Table 46: I/O

AC characteristics.

Updated tres(TIM) in Table 48: Characteristics of TIMx connected to the

APB1 domain. Modified tres(TIM) and fEXT Table 49: Characteristics of

TIMx connected to the APB2 domain.

Table 94.

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