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ADC12D040CIVS/NOPB Datasheet(PDF) 22 Page - Texas Instruments

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Part # ADC12D040CIVS/NOPB
Description  Dual 12-Bit, 40 MSPS, 600 mW A/D Converter with Internal/External Reference
PDF  31 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ADC12D040CIVS/NOPB Datasheet(HTML) 22 Page - Texas Instruments

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ADC12D040
SNAS171D – MAY 2004 – REVISED DECEMBER 2005
www.ti.com
The INT/EXT REF Pin
The INT/EXT REF pin determines whether the internal reference or an external reference voltage is used. With
this pin at a logic low, the internal 2.0V reference is in use. With this pin at a logic high an external reference
must be applied to the VREF pin, which should then be bypassed to ground. There is no need to bypass the VREF
pin when the internal reference is used. There is no access to the internal reference voltage, but its value is
approximately equal to VRP − VRN. See Section 1.2
DATA OUTPUT PINS
The ADC12D040 has 24 TTL/CMOS compatible Data Output pins. Valid data is present at these outputs while
the OE and PD pins are low. While the tOD time provides information about output timing, tOD will change with a
change of clock frequency. At the rated 40 MHz clock rate, the data transition is about 6 to 10 ns after the rise of
the clock and about 4 to 10 ns before the fall of the clock (depending upon VDR), so either clock edge may be
used to capture data, depending upon the data setup time of the circuit accepting the data. Also, circuit board
layout will affect relative delays of the clock and data, so it is important to consider these relative delays when
designing the digital interface. At sample frequencies below 40 MHz, there is a longer time between data
transition and the fall of the clock, so that the falling edge of the clock is generally the best edge to use for output
data capture at low sample rates.
Be very careful when driving a high capacitance bus. The more capacitance the output drivers must charge for
each conversion, the more instantaneous digital current flows through VDR and DR GND. These large charging
current spikes can cause on-chip ground noise and couple into the analog circuitry, degrading dynamic
performance. Adequate bypassing, limiting output capacitance and careful attention to the ground plane will
reduce this problem. Additionally, bus capacitance beyond the specified 20 pF/pin will cause tOD to increase,
making it difficult to properly latch the ADC output data. The result could be an apparent reduction in dynamic
performance.
To minimize noise due to output switching, minimize the load currents at the digital outputs. This can be done by
connecting buffers (74AC541, for example) between the ADC outputs and any other circuitry. Only one driven
input should be connected to each output pin. Additionally, inserting series resistors of about 100
Ω at the digital
outputs, close to the ADC pins, will isolate the outputs from trace and other circuit capacitances and limit the
output currents, which could otherwise result in performance degradation. See Figure 5.
Note that, although the ADC12D040 has Tri-State outputs, these outputs should not be used to drive a bus and
the charging and discharging of large capacitances can degrade SNR performance. Each output pin should drive
only one pin of a receiving device and the interconnecting lines should be as short as practical.
POWER SUPPLY CONSIDERATIONS
The power supply pins should be bypassed with a 10 µF capacitor and with a 0.1 µF ceramic chip capacitor
within a centimeter of each power pin. Leadless chip capacitors are preferred because they have low series
inductance.
As is the case with all high-speed converters, the ADC12D040 is sensitive to power supply noise. Accordingly,
the noise on the analog supply pin should be kept below 100 mVP-P.
No pin should ever have a voltage on it that is in excess of the supply voltages, not even on a transient basis. Be
especially careful of this during turn on and turn off of power.
The VDR pin provides power for the output drivers and may be operated from a supply in the range of 2.35V to
VD (nominal 5V). This can simplify interfacing to low voltage devices and systems. Note, however, that tOD
increases with reduced VDR. DO NOT operate the VDR pin at a voltage higher than VD.
LAYOUT AND GROUNDING
Proper grounding and proper routing of all signals are essential to ensure accurate conversion. Maintaining
separate analog and digital areas of the board, with the ADC12D040 between these areas, is required to achieve
specified performance.
The ground return for the data outputs (DR GND) carries the ground current for the output drivers. The output
current can exhibit high transients that could add noise to the conversion process. To prevent this from
happening, the DR GND pins should NOT be connected to system ground in close proximity to any of the
ADC12D040's other ground pins.
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