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VND830ASP-E Datasheet(PDF) 20 Page - STMicroelectronics |
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VND830ASP-E Datasheet(HTML) 20 Page - STMicroelectronics |
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20 / 27 page ![]() Package and PCB thermal data VND830ASP-E 20/27 Doc ID 17605 Rev 2 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 21. PowerSO-10 PC board(1) 1. Layout condition of Rth and Zth measurements (PCB FR4 area= 58 mm x 58 mm, PCB thickness=2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 8 cm2). Figure 22. Rthj-amb vs PCB copper area in open box free air condition 30 35 40 45 50 55 02 4 6 8 10 PCB Cu heatsink area (cm^2) RTHj_amb (°C/W) Tj-Tamb=50°C |
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