UPD753012 datasheet(70/80 Pages) NEC

70 / 80 page

µPD753012, 753016, 753017

14. RECOMMENDED SOLDERING CONDITIONS

Solder the

µPD753017 under the following recommended conditions.

For the details on the recommended soldering conditions, refer to Information Document Semiconductor

Device Mounting Technology Manual (C10535E).

For the soldering methods and conditions other than those recommended, consult NEC.

Table 14-1. Soldering Conditions of Surface Mount Type

(1)

µPD753012GC-XXX-3B9: 80-pin plastic QFP (14 × 14 mm)

µPD753016GC-XXX-3B9: 80-pin plastic QFP (14 × 14 mm)

µPD753017GC-XXX-3B9: 80-pin plastic QFP (14 × 14 mm)

Symbol of

Soldering Method

Soldering Conditions

Recommended

Condition

Infrared reflow

Package peak temperature: 235 ˚C, Time: 30 seconds max. (210 ˚C min.),

IR35-00-3

Number of times: 3 max.

VPS

Package peak temperature: 215 ˚C, Time: 40 seconds max. (200 ˚C min.),

VP15-00-3

Number of times: 3 max.

Wave soldering

Solder bath temperature: 260 ˚C max., Time: 10 seconds max.,

WS60-00-1

Number of times: 1

Preheating temperature: 120 ˚C max. (package surface temperature)

Partial heating

Pin temperature: 300 ˚C max., Time: 3 seconds max. (per side of device)

–

Caution Do not use two or more soldering methods in combination (except partial heating).

UPD753012 Datasheet(PDF) 70 Page - NEC