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UT699E-CPC Datasheet(PDF) 38 Page - Aeroflex Circuit Technology |
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UT699E-CPC Datasheet(HTML) 38 Page - Aeroflex Circuit Technology |
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38 / 41 page ![]() 38 Aeroflex Microelectronics Solutions - HiRel 36-00-00-001 Ver. 1.5.0 7.0 Ordering Information UT699E LEON 3FT Package Option Associated Lead Finish (Z) 484-CLGA (C) Gold (S) 484-CCGA (A) Solder (C) 484-CBGA (A) Solder Lead Finish: (NOTE 1) (C) = Gold (A) = Solder Screening Level: (NOTE 2 & 3) (P) = Prototype (Temperature Range: 25oC only) (E) = HiRel (Temperature Range: -55oC to +105oC) Case Outline: (Z) = 484-Ceramic Land Grid Array (S) = 484-Ceramic Column Grid Array (C) = 484-Ceramic Ball Grid Array (High Temp Solder Balls) UT699E 32-bit LEON 3FT UT699E - * * * Notes: 1. Lead finish (A or C) must be specified. 2. Prototype Flow per Aeroflex Manufacturing Flows Document. Devices are tested at 25oC only. Radiation is neither tested nor guaranteed. 3. HiRel Flow per Aeroflex Manufacturing Flows Document. Radiation is neither tested nor guaranteed. |
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