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TFP501PZP Datasheet(PDF) 8 Page - Texas Instruments |
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TFP501PZP Datasheet(HTML) 8 Page - Texas Instruments |
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8 / 24 page ![]() TFP501 SLDS127C – JULY 2001 – REVISED JULY 2011 www.ti.com AC ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VID(2) Differential input sensitivity (1) 150 mVp-p VID(3) Maximum differential input 1560 mVp-p tsk(D) Analog input intra-pair (+ to –) differential skew (2) 0.4 t(bit) (3) ns tsk(CC) Analog input intra-pair or channel to channel 1.0 t(pixel) (4) ns skew (2) Worst case differential input clock jitter tolerance (5) 112 MHz, 1 pixel/clock 200 ps (2) ST = Low, CL = 10 pF 1.9 tr(1) Rise time of data and control signals (6) (7) ns ST = High, CL = 10 pF 1.9 ST = Low, CL = 10 pF 1.9 tf(1) Fall time of data and control signals (6) (7) ns ST = High, CL = 10 pF 1.9 ST = Low, CL = 5 pF 1.9 tr(2) Rise time of ODCK clock (6) ns ST = High, CL = 10 pF 1.9 tf(2) Fall time of ODCK clock (6) ST = Low, CL = 5 pF 1.9 ns ST = High, CL = 10 pF 1.9 ST = Low, CL = 10 pF 1.2 1 pixel/clock, PIXS = low, ns OCK_INV = low ST = High, CL = 10 pF 1.2 2 pixel/clock, PIXS = high, ST = Low, CL = 10 pF 2.7 Setup time, data and control signal to falling edge STAG = high, ns tsu(1) of ODCK (7) ST = High, CL = 10 pF 2.7 OCK_INV = low 2 pixel and STAG ST = Low, CL = 10 pF 1.7 PIXS = high, STAG = low, ns ST = High, CL = 10 pF 1.7 OCK_INV = low ST = Low, CL = 10 pF 0.9 1 pixel/clock, PIXS = low, ns OCK_INV = low ST = High, CL = 10 pF 0.9 Hold time, data and control signal to falling edge of th(1) ODCK (7) 2 pixel and STAG, ST = Low, CL = 10 pF 2.9 PIXS = high, STAG = low, ns 2.9 ST = High, CL = 10 pF OCK_INV = low 1 pixel/clock, PIXS = low, ST = Low, CL = 10 pF 1.9 ns OCK_INV = high ST = High, CL = 10 pF 1.9 2 pixel/clock, PIXS = high, ST = Low, CL = 10 pF 2.9 STAG = high, ns Setup time, data and control signal to rising edge of 2.9 tsu(2) ST = High, CL = 10 pF OCK_INV = high ODCK (7) 2 pixel and STAG, ST = Low, CL = 10 pF 2.0 PIXS = high, ns 2.0 STAG = low, ST = High, CL = 10 pF OCK_INV = high 1 pixel/clock, PIXS = low, ST = Low, CL = 10 pF 0.5 ns OCK_INV = high ST = High, CL = 10 pF 0.5 Hold time, data and control signal to rising edge of th(2) ODCK (7) 2 pixel and STAG, ST = Low, CL = 10 pF 1.4 PIXS = high, STAG = Low, ns 1.4 ST = High, CL = 10 pF OCK_INV = high PIX = Low 25 165 f(ODCK) ODCK frequency MHz PIX = High 12.5 82.5 ODCK duty-cycle 45% 50% 60% tpd(PDL) Propagation delay time from PD low to Hi-Z outputs 18 ns tpd(PDOL) Propagation delay time from PDO low to Hi-Z 18 ns outputs t(HSC) Time between DE transition to SCDT low (8) 165 MHz 25 ms tt(FSC) Time between DE low to SCDT high (8) 8 trans(DE) (9) td(st) ODCK latching edge to QE[23:0] data output STAG = Low, PIXS = High 0.2-5t(pixel) ns (1) Specified as ac parameter to include sensitivity to overshoot, undershoot and reflection. (2) By characterization (3) t(bit) is 1/10 the pixel time, tpix (4) t(pixel) is the pixel time defined as the period of the RxC input clock. The period of ODCK is equal to tpix in 1-pixel/clock mode or 2tpix when in 2-pixel/clock mode. (5) Measured differentially at 50% crossing using ODCK output clock as trigger. (6) Rise and fall times measured as time between 20% and 80% of signal amplitude. (7) Data and control signals are : QE[23:0], QO[23:0], DE, HSYNC, VSYNC and CTL[2:1] (8) Link active or inactive is determined by amount of time detected between DE transitions. SCDT indicates link activity. (9) trans(DE) is one transition (low-to-high or high-to-low) of the DE signal. 8 Copyright © 2001–2011, Texas Instruments Incorporated |
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