12

PRELIMINARY

AT91SAM7A1 Summary

6048AS–ATARM–07/04

Soldering Profile

Table 4 gives the recommended soldering profile from J-STD-20.

Small packages may be subject to higher temperatures if they are reflowed in boards

with larger components. In this case, small packages may have to withstand tempera-

tures of up to 235

°C, not 220°C (IR reflow).

Recommended package reflow conditions depend on package thickness and volume.

See Table 5.

Notes:

1. The packages are qualified by Atmel by using IR reflow conditions, not convection or

VPR.

2. By default, the package level 1 is qualified at 220

°C (unless 235°C is stipulated).

3. The body temperature is the most important parameter but other profile parameters

such as total exposure time to hot temperature or heating rate may also influence

component reliability.

A maximum of three reflow passes is allowed per component.

Table 4. Soldering Profile

Convection or

IR/Convection

VPR

Average Ramp-up Rate (183

°C to Peak)

3

°C/sec. max.

10

°C/sec.

Preheat Temperature 125

°C ±25°C

120 sec. max

Temperature Maintained Above 183

°C

60 sec. to 150 sec.

Time within 5

°C of Actual Peak

Temperature

10 sec. to 20 sec.

60 sec.

Peak Temperature Range

220 +5/-0

°C or

235 +5/-0

°C

215 to 219

°C or

235 +5/-0

°C

Ramp-down Rate

6

°C/sec.

10

°C/sec.

Time 25

°C to Peak Temperature

6 min. max

Parameter

Temperature

Convection

220 +5/-0

°C

VPR

215 to 219

°C

IR/Convection

220 +5/-0

°C