FT311D-32L1C-R datasheet(35/40 Pages) FTDI

35 / 40 page

DS_FT311D

USB ANDROID HOST IC Datasheet

Version 1.2

Document No.: FT_000660 Clearance No.: FTDI# 305

Profile Feature

Pb Free Solder Process

(green material)

SnPb Eutectic and Pb free (non

green material) Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

see

Figure 9-5

Time within 5°C of actual Peak Temperature

(tp)

30 to 40 seconds

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 9.1 Reflow Profile Parameter Values

SnPb Eutectic and Pb free (non green material)

Package Thickness

Volume mm3 < 350

Volume mm3 >=350

< 2.5 mm

235 +5/-0 deg C

220 +5/-0 deg C

≥ 2.5 mm

220 +5/-0 deg C

Pb Free (green material) = 260 +5/-0 deg C

Table 9.2 Package Reflow Peak Temperature

FT311D-32L1C-R Datasheet(PDF) 35 Page - Future Technology Devices International Ltd.

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