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STM32F101XF Datasheet(PDF) 11 Page - STMicroelectronics

Part # STM32F101XF
Description  Single-cycle multiplication and hardware division
PDF  117 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F101XF Datasheet(HTML) 11 Page - STMicroelectronics

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STM32F101xF, STM32F101xG
Description
2.1
Device overview
The STM32F101xx XL-density access line family offers devices in 3 different package
types: from 64 pins to 144 pins. Depending on the device chosen, different sets of
peripherals are included, the description below gives an overview of the complete range of
peripherals proposed in this family.
Figure 1 shows the general block diagram of the device family.
Table 2. STM32F101xF and STM32F101xG features and peripheral counts
Peripherals
STM32F101Rx
STM32F101Vx
STM32F101Zx
Flash memory
768 KB
1 MB
768 KB
1 MB
768 KB
1 MB
SRAM in Kbytes
80
80
80
FSMC
No
Yes
Yes
Timers
General-purpose
10
Basic
2
Communication
interfaces
SPI
3
I2C2
USART
5
GPIOs
51
80
112
12-bit ADC
Number of channels
1
16
12-bit DAC
Number of channels
YES
2
CPU frequency
36 MHz
Operating voltage
2.0 to 3.6 V
Operating temperatures
Ambient temperature: –40 to +85 °C (see Table 10)
Junction temperature: –40 to +105 °C (see Table 10)
Package
LQFP64
LQFP100(1)
1. For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a
multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND
Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available
in this package.
LQFP144



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