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STM32F383RC Datasheet(PDF) 58 Page - STMicroelectronics

Part # STM32F383RC
Description  Reset and power management
PDF  125 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F383RC Datasheet(HTML) 58 Page - STMicroelectronics

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Electrical characteristics
STM32F383xx
58/125
DocID023367 Rev 2
6.3.2
Operating conditions at power-up / power-down
The parameters given in Table 23 are derived from tests performed under the ambient
temperature condition summarized in Table 22.
PD
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for
suffix 7(4)
WLCSP66
376
mW
LQFP100
434
LQFP64
444
LQFP48
364
BGA100
338
TA
Ambient temperature for 6 suffix
version
Maximum power dissipation
–40
85
°C
Low power dissipation(5)
–40
105
Ambient temperature for 7 suffix
version
Maximum power dissipation
–40
105
°C
Low power dissipation(5)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125
1. When the ADC is used, refer to Table 58: ADC characteristics.
2. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.
3. VDDSD12 is the external power supply for the PB10, and PE7 to PE15 I/O pins (the I/O pin ground is
internally connected to VSS). VDDSD3 is the external power supply for PB14 to PB15 and PD8 to PD15
I/O pins (the I/O pin ground is internally connected to VSS).
4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
5. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.
Table 22. General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Table 23. Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
0
∞
µs/V
VDD fall time rate
20
∞
tVDDA
VDDA rise time rate
0
∞
VDDA fall time rate
20
∞



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