33996

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

4

MAXIMUM RATINGS

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

VPWR Supply Voltage (Note 1)

-1.5 to 50

V

SO Output Driver Power Supply Voltage (Note 1)

-0.3 to 7.0

V

SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST) (Note 1)

-0.3 to 7.0

V

Output Drain Voltage

-0.3 to 45

V

Frequency of SPI Operation (Note 2)

6.0

MHz

Output Clamp Energy (Note 3)

50

mJ

ESD Voltage (Note 4)

Human Body Model (Note 5)

Machine Model (Note 6)

±2000

±200

V

Storage Temperature

-50 to 150

°C

Operating Case Temperature

-40 to 125

°C

Operating Junction Temperature

-40 to 150

°C

1.5

W

Lead Soldering Temperature (Note 8)

260

°C

Thermal Resistance

Junction-to-Ambient (Note 9)

Junction- to-Lead (Note 10)

Junction-to-Flag

75

8.0

1.2

°C/W

Notes

1.

Exceeding these limits may cause malfunction or permanent damage to the device.

2.

This parameter is guaranteed by design but not production tested.

3.

Maximum output clamp energy capability at 150

°C junction temperature using single nonrepetitive pulse method.

4.

ESD data available upon request.

5.

6.

7.

Maximum power dissipation with no heat sink used.

8.

Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

9.

Tested per JEDEC test JESD52-2 (single-layer PWB).

10.

Tested per JEDEC test JESD51-8 (two-layer PWB).

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com