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STM32F103XC Datasheet(PDF) 112 Page - STMicroelectronics |
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STM32F103XC Datasheet(HTML) 112 Page - STMicroelectronics |
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112 / 143 page ![]() Electrical characteristics STM32F103xC, STM32F103xD, STM32F103xE 112/143 DS5792 Rev 13 Figure 61. 12-bit buffered /non-buffered DAC 1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the DAC_CR register. Offset(3) Offset error (difference between measured value at Code (0x800) and the ideal value = VREF+/2) -- ±10 mV - -- ±3 LSB Given for the DAC in 10-bit at VREF+ = 3.6 V -- ±12 LSB Given for the DAC in 12-bit at VREF+ = 3.6 V Gain error(3) Gain error - - ±0.5 % Given for the DAC in 12bit configuration tSETTLING(3) Settling time (full scale: for a 10-bit input code transition between the lowest and the highest input codes when DAC_OUT reaches final value ±1LSB -3 4 µs CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ Update rate(3) Max frequency for a correct DAC_OUT change when small variation in the input code (from code i to i+1LSB) -- 1 MS/ s CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ tWAKEUP(3) Wakeup time from off state (Setting the ENx bit in the DAC Control register) -6.5 10 µs CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ input code between lowest and highest possible ones. PSRR+ (1) Power supply rejection ratio (to VDDA) (static DC measurement - –67 –40 dB No RLOAD, CLOAD = 50 pF 1. Guaranteed by design. 2. Guaranteed by characterization. 3. The quiescent mode corresponds to a state where the DAC maintains a stable output level to ensure that no dynamic consumption occurs. 4. Guaranteed by characterization results. Table 63. DAC characteristics (continued) Symbol Parameter Min Typ Max Unit Comments |
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