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STM32F103XC Datasheet(PDF) 115 Page - STMicroelectronics |
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STM32F103XC Datasheet(HTML) 115 Page - STMicroelectronics |
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115 / 143 page  DS5792 Rev 13 115/143 STM32F103xC, STM32F103xD, STM32F103xE Package information 135 Figure 63. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package recommended footprint b 0.350 0.400 0.450 0.0138 0.0157 0.0177 D 9.900 10.000 10.100 0.3898 0.3937 0.3976 D1 - 8.800 - - 0.3465 - E 9.900 10.000 10.100 0.3898 0.3937 0.3976 E1 - 8.800 - - 0.3465 - e - 0.800 - - 0.0315 - F - 0.600 - - 0.0236 - ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. STATSChipPAC package dimensions. Table 66. LFBGA144 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 mm Dpad 0.400 mm Table 65. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Typ Min Max |
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