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VNH7040AY Datasheet(PDF) 37 Page - STMicroelectronics |
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VNH7040AY Datasheet(HTML) 37 Page - STMicroelectronics |
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37 / 48 page ![]() DocID028118 Rev 5 37/48 VNH7040AY Package and PCB thermal data 47 thermal via diameter 0.3 mm ± 0.08 mm, Cu thickness on vias 0.025 mm, footprint dimension 4.1 mm x 6.5 mm. Figure 22. Chipset configuration Figure 23. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition |
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