S32K311NHT0MPAST datasheet(21/137 Pages) NXP

21 / 137 page

Table 3. Voltage and current operating requirements (continued)

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

IINJPAD_DC_OP

Continuous DC input

current (positive/

negative) that can be

injected into an I/O

pin 6

-2

—

VDD_HV_A >= 2.97V

—

IINJSUM_DC_OP

Sum of

absolute value of

injected currents

on all the I/O

pins (continuous

DC limit) 6

-30

—

VDD_HV_A >= 3.6V

—

IINJSUM_DC_OP

Sum of

absolute value of

injected currents

on all the I/O

pins (continuous

DC limit) 6

-20

—

VDD_HV_A >= 2.97V

—

Vramp_slow

Supply ramp rate

(slow) 1, 7

0.5

—

V/min

—

Vramp_fast

Supply ramp rate

(fast) 1, 7

—

100

V/ms

—

1. All voltages are referred to VSS unless otherwise specified.

2. If total power dissipation and maximum junction temperature allows. Please refer to Thermal operating characteristics

table for the maximum junction temperature, and Thermal characteristics table for the thermal characteristics, to determine

the maximum power dissipation allowed for a given package.

3. You must ensure that the junction temperature in the application must not exceed the maximum specified Tj.

4. VREFH should always be equal to or less than VDD_HV_A +0.1. Any positive differential voltage between VREFH and

VDD_HV_A i.e., VDD_HV_A < VREFH <= VDD_HV_A + 0.1V) is for RF-AC only. Appropriate decoupling capacitors should

be used to filter noise on the supplies. See application note AN5032 for reference supply design for SAR ADC.

5. Open-drain outputs must be pulled respectively to their supply rail (VDD_HV_A or VDD_HV_B).

6. When input pad voltage levels are close to VDD_HV_A (respectively to VDD_HV_B) or VSS, practically no current injection

is possible.

7. The MCU supply ramp rate parameter must be applicable to the MCU input/external supplies. The ramp rate assumes that

the S32K3xx HW design guidelines available on www.nxp.com are followed.

5.3 Thermal operating characteristics

Table 4. Thermal operating characteristics

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

Tamb

Ambient temperature -40

—

125

°C

—

Junction

temperature

-40

—

150

°C

—

For S32K388, applications running at 125°C Tamb, thermal management schemes at PCB level will have to be deployed to keep

TJ below 150°C.

NXP Semiconductors

General

S32K3xx Data Sheet, Rev. 5.2, 10/2022

Data Sheet: Technical Data

Preliminary Information

21 / 137

S32K311NHT0MPAST Datasheet(PDF) 21 Page - NXP Semiconductors

S32K311NHT0MPAST Datasheet(HTML) 21 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL