STM32L062C8 datasheet(102/124 Pages) STMICROELECTRONICS

Part #	STM32L062C8

Description	Ultra-low-power 32-bit MCU Arm®-based Cortex®-M0, 64 KB Flash,8 KB SRAM, 2 KB EEPROM, USB, ADC, DAC, AES

PDF	124 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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102 / 124 page

Package information

STM32L062x8

102/124

DS10183 Rev 11

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at www.st.com. ECOPACK

is an ST trademark.

7.1

UFQFPN48 package information

Figure 32. UFQFPN48 - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package outline

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this back-side pad to PCB ground.

A0B9_ME_V3

Pin 1 identifier

laser marking area

Exposed pad

area

Detail Z

R 0.125 typ.

C 0.500x45°

pin1 corner

Seating

plane

ddd

Detail Y

STM32L062C8 Datasheet(PDF) 102 Page - STMicroelectronics