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STM32L062C8 Datasheet(PDF) 105 Page - STMicroelectronics |
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STM32L062C8 Datasheet(HTML) 105 Page - STMicroelectronics |
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105 / 124 page ![]() DS10183 Rev 11 105/124 STM32L062x8 Package information 117 7.2 Standard WLCSP36 package information Figure 35. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. 2. b dimensions is measured at the maximum bump diameter parallel to primary datum Z Table 72. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A- - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025(2) - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 2.59 2.61 2.63 0.102 0.103 0.104 E 2.86 2.88 2.90 0.112 0.113 0.114 e - 0.40 - - 0.016 - e1 - 2.00 - - 0.079 - e2 - 2.00 - - 0.079 - A1 orientation reference Wafer back side E D Detail A (rotated 90 °) Seating plane A1 Bump b Side view A A2 Detail A e1 F G e e A1 ball location e2 Bump side eee Z A01Y_ME_V2 F A 6 1 A3 ZX Y Z ccc ddd Øb (36 balls) Z aaa 4x bbb Z |
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