| Electronic Components Datasheet Search |
|
STM32L062C8 Datasheet(PDF) 106 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STM32L062C8 Datasheet(HTML) 106 Page - STMicroelectronics |
|
106 / 124 page ![]() Package information STM32L062x8 106/124 DS10183 Rev 11 Figure 36. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale recommended footprint F- 0.305(3) - - 0.012 - G- 0.440(3) - - 0.017 - aaa - - 0.100 - - 0.004 bbb - - 0.100 - - 0.004 ccc - - 0.100 - - 0.004 ddd - - 0.050 - - 0.002 eee - - 0.050 - - 0.002 1. Values in inches are converted from mm and rounded to the 3rd decimal place. 2. Nominal dimension rounded to the 3rd decimal place results from process capability. 3. Calculated dimensions are rounded to the 3rd decimal place. Table 73. Standard WLCSP36 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed Table 72. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max MS18965V2 Dsm Dpad |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |